UHLMANN RUEDIGER has a total of 12 patent applications. Its first patent ever was published in 1977. It filed its patents most often in German Democratic Republic and United States. Its main competitors in its focus markets semiconductors and machine tools are ORION SYSTEMS INTEGRATION PTE LTD, SEMILEDS CORP and LIU CHUNG-SHI.
# | Country | Total Patents | |
---|---|---|---|
#1 | German Democratic Republic | 11 | |
#2 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machine tools |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Soldering, welding and flame cutting |
# | Name | Total Patents |
---|---|---|
#1 | Uhlmann Ruediger | 12 |
#2 | Rudolf Frank | 4 |
#3 | Hopf Peter | 4 |
#4 | Oehme Michael | 3 |
#5 | Kriebel Frank | 1 |
#6 | Schneidewind Stefan | 1 |
#7 | Schubert Birgit | 1 |
#8 | Heinke Gottfried | 1 |
#9 | Schulze Frank-Peter | 1 |
#10 | Lessig Hans-Joerg | 1 |
Publication | Filing date | Title |
---|---|---|
DD159385A1 | Device for automatic loading of structural strips in injection molding machines | |
DD158445A1 | Method for producing plastum-half semiconductor components | |
DD158076A1 | Method for gluing semiconductor chips on carrier bolts | |
DD152026A1 | Method for assembling integrated circuits | |
DD145823A1 | Appendix for contacting chips | |
DD144331A2 | Bonding a wire with a connection plate | |
DD139346A1 | Device for fusing | |
DD139345A1 | Device for fusing | |
DD138454A1 | Device for melting a thickness to a bonded wire | |
DD136324A1 | Bonding on staerker oxydating connection plates |