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TANAKA ELECTRONICS IND

Overview
  • Total Patents
    624
  • GoodIP Patent Rank
    14,895
  • Filing trend
    ⇧ 700.0%
About

TANAKA ELECTRONICS IND has a total of 624 patent applications. It increased the IP activity by 700.0%. Its first patent ever was published in 1974. It filed its patents most often in Japan, Taiwan and China. Its main competitors in its focus markets semiconductors, materials and metallurgy and machine tools are UNO TOMOHIRO, TANAKA ELECTRONICS IND CO LTD and LIU CHUNG-SHI.

Patent filings per year

Chart showing TANAKA ELECTRONICS INDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chiba Jun 64
#2 Kogashiwa Toshinori 58
#3 Mikami Michitaka 55
#4 Amano Hiroyuki 55
#5 Antoku Yuki 53
#6 Murai Hiroshi 40
#7 Kujiraoka Takeshi 40
#8 Shirakawa Shinji 40
#9 Chen Wei 37
#10 Hayashi Shiyouzou 36

Latest patents

Publication Filing date Title
WO2021065036A1 Wire joining structure, bonding wire used in same, and semiconductor device
WO2020246094A1 Palladium-coated copper bonding wire, method for producing palladium-coated copper bonding wire, semiconductor device using same, and method for producing same
WO2020183748A1 Palladium-coated copper bonding wire, method for producing palladium-coated copper bonding wire, wire junction structure using same, semiconductor device, and method for producing same
WO2020136921A1 Wire sealing body
WO2019009312A1 Bonding wire winding spool, winding structure, and spool case
WO2019008803A1 Winding spool, bonding wire wound structure and spool case for winding spool
CN105914156A Palladium-coated copper wire for ball bonding
CN105405828A Cross-sectional structure of fine copper alloy wire for ultrasonic bonding
CN105390463A Construction of copper thin nickel alloy wire for joint of semiconductor device
SG10201404247VA Wire structure of dilute alloys of nickel in copper for bonding semiconductor device
TWI509089B Cross-section structure of pure-copper alloy wire for ultrasonic bonding
TWI510652B Copper rarefied-nickel alloy wire structure for bonding semiconductor devices
WO2013030968A1 Rectangular, aluminum-, gold-, palladium- or platinum-coated copper ribbon for semiconducter element
TW201307589A Silver cladded copper ribbon having flat square shape for high temperature semiconductor elements
TW201308434A Gold plated copper ribbon having flat square shape for high temperature semiconductor elements
TW201305362A Palladium or platinum plated copper ribbon having flat square shape for high temperature semiconductor elements
TW201306101A Aluminium plated copper ribbon having flat square shape for semiconductor elements
TW201250013A High strength and high elongation ratio of Au alloy bonding wire
MY153144A Method for heat-treatment of a bonding wire for semiconductor device
WO2012169067A1 High-strength, high-elongation-percentage gold alloy bonding wire