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TANAKA ELECTRONICS IND CO LTD

Overview
  • Total Patents
    126
  • GoodIP Patent Rank
    95,839
About

TANAKA ELECTRONICS IND CO LTD has a total of 126 patent applications. Its first patent ever was published in 1998. It filed its patents most often in Japan and Taiwan. Its main competitors in its focus markets semiconductors, materials and metallurgy and machine tools are TANAKA ELECTRONICS IND, ADVANCED INTERCONNECT TECH LTD and LIN JING-CHENG.

Patent filings in countries

World map showing TANAKA ELECTRONICS IND CO LTDs patent filings in countries
# Country Total Patents
#1 Japan 125
#2 Taiwan 1

Patent filings per year

Chart showing TANAKA ELECTRONICS IND CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Amano Hiroyuki 24
#2 Mikami Michitaka 23
#3 Takada Mitsuo 16
#4 Chiba Atsushi 15
#5 Nakajima Shinichiro 15
#6 Yasutoku Yuki 13
#7 Okazaki Junichi 13
#8 Mitoma Shuichi 13
#9 Yamashita Tsutomu 12
#10 Hamamoto Takuya 11

Latest patents

Publication Filing date Title
JP2020174161A Gold-coated silver bonding wire and manufacturing method thereof, and semiconductor device and manufacturing method thereof
JP2020129613A Palladium-coated copper bonding wire, wire bonding structure, semiconductor device and method for manufacturing semiconductor device
JP2020088172A Palladium-coated cupper bonding wire and manufacturing method thereof
JP2019186248A Noble metal-coated silver wire for ball bonding and manufacturing method of the same, and semiconductor device using noble metal-coated silver wire for ball bonding and manufacturing method of the same
JP2019186246A Noble metal-coated silver wire for ball bonding and manufacturing method of the same, and semiconductor device using noble metal-coated silver wire for ball bonding and manufacturing method of the same
JP2018064050A Copper alloy wire for ball bonding
JP2017092224A Winding structure of bonding wire for semiconductor device
JP2017092078A Noble metal-coated copper wire for use in ball bonding
JP2016157912A PALLADIUM(Pd)-COATED COPPER WIRE FOR BALL BONDING
JP2017050407A Palladium-coated copper wire for ball bonding
JP2017048431A Copper alloy fine wire for ball bonding
JP2017048432A Copper alloy fine wire for ball bonding
JP2017045914A GOLD(Au)-DISPERSED COPPER WIRE FOR BALL BONDING
JP2017045924A Copper Alloy Bonding Wire
JP2016157745A PALLADIUM(Pd)-COATED COPPER WIRE FOR BALL BONDING
JP2016072261A Silver gold alloy bonding wire
JP2016029691A Structure of surface property-modified silver palladium alloy wire
JP2015005576A Cross-section structure of pure-copper alloy wire for ultrasonic bonding
JP2015002213A Structure of coating copper wire for ultrasonic bonding
JP2014224283A Corrosion resistant aluminum alloy bonding wire