| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 5 | |
| #2 | Taiwan | 5 | |
| #3 | WIPO (World Intellectual Property Organization) | 3 | |
| #4 | Philippines | 1 | |
| #5 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machine tools |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Soldering, welding and flame cutting |
| # | Name | Total Patents |
|---|---|---|
| #1 | Sen Amlan | 14 |
| #2 | Lim Raymond Shoa Siong | 4 |
| #3 | Chew Jimmy Hwee Seng | 4 |
| #4 | Ong Chee Kian | 2 |
| #5 | Chew Hwee-Seng | 2 |
| #6 | Chew Hwee Seng | 2 |
| #7 | Lim Shoa-Siong | 2 |
| #8 | Lim Kian Hock | 2 |
| #9 | Khaw Chin Guan | 2 |
| #10 | Lim Shoa Siong | 2 |
| Publication | Filing date | Title |
|---|---|---|
| WO2015038074A1 | System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method | |
| TW201515160A | Apparatus and method for bonding a plurality of semiconductor chips onto a substrate | |
| SG195237A1 | Method and systems for semiconductor chip pick & transfer and bonding | |
| CN102272907B | In-situ melt and reflow process for forming flip-chip interconnections and system thereof | |
| TW200939373A | Pre-heating system and method for silicon dies |