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SHINKAWA SEISAKUSHO KK

Overview
  • Total Patents
    173
  • GoodIP Patent Rank
    234,538
About

SHINKAWA SEISAKUSHO KK has a total of 173 patent applications. Its first patent ever was published in 1974. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, mechanical elements and computer technology are HUATIAN TECH XI AN CO LTD, SHANGHAI GEYI ELECTRONICS CO LTD and ZHONGHUA PICTURE TUBE CO LTD.

Patent filings in countries

World map showing SHINKAWA SEISAKUSHO KKs patent filings in countries
# Country Total Patents
#1 Japan 173

Patent filings per year

Chart showing SHINKAWA SEISAKUSHO KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yamazaki Nobuhito 63
#2 Hasegawa Takeshi 45
#3 Sugiura Kazuo 26
#4 Chiba Seiichi 20
#5 Kushima Yoshimitsu 13
#6 Torihata Minoru 12
#7 Hayakawa Kazuhiro 11
#8 Kojima Hisaaki 11
#9 Nishizaki Masashi 11
#10 Yamazaki Masao 11

Latest patents

Publication Filing date Title
JP2020001791A Nesting rack
JP2005074209A Bathing device for physically handicapped person
JPS57164543A Intermittent transfer equipment for film-carrier
JPS57145336A Transfer table feed gear in bonding device
JPS57145337A Ultrasonic wire bonding device
JPS5771141A Ultrasonic wire bonding for semiconductor
JPS57173949A Wire bonding method
JPS57173954A Ultrasonic wave wire bonding device
JPS57167645A Wire bonding method
JPS57167646A Ultrasonic wire bonding method
JPS57160135A Automatic bonding method for inner lead
JPS57160136A Manipulator in planar movement system for semiconductor device
JPS57160134A Pellet bonding apparatus
JPS57152133A Die bonding method
JPS57152136A Wire bonding method
JPS57147245A Positioning method and device for chip bonding
JPS57141777A Pattern recognizing device
JPS57138200A Stick holding mechanism
JPS57138151A Bonding method for tape
JPS57138596A Compensator for position of die