| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 6 | |
| #2 | China | 3 | |
| #3 | Taiwan | 3 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Lin Diann-Fang | 6 |
| #2 | Lin Diann Fang | 4 |
| #3 | Hu Yu-Shan | 2 |
| #4 | Hu Yu Shan | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2016293509A1 | Metal top stacking package structure and method for manufacturing the same | |
| US9412722B1 | Multichip stacking package structure and method for manufacturing the same | |
| US2016233182A1 | Semiconductor packaging structure having stacked seed layers | |
| TW201546889A | Packaging structure for thin die and method for manufacturing the same | |
| US2015228561A1 | Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structure |