|
US2018240722A1
|
|
Hermetic lid seal printing method
|
|
US10115645B1
|
|
Repackaged reconditioned die method and assembly
|
|
US2018053702A1
|
|
3D printed hermetic package assembly and method
|
|
US2019118346A1
|
|
Conductive diamond application method
|
|
US2018047685A1
|
|
Remapped packaged extracted die
|
|
US2019122227A1
|
|
Counterfeit integrated circuit detection by comparing integrated circuit signature to reference signature
|
|
US2018047700A1
|
|
Method for remapping a packaged extracted die with 3D printed bond connections
|
|
US2018061724A1
|
|
Method for remapping a packaged extracted die
|
|
US2018040529A1
|
|
Remapped packaged extracted die with 3D printed bond connections
|
|
US2016225686A1
|
|
Repackaged integrated circuit and assembly method
|
|
US9966319B1
|
|
Environmental hardening integrated circuit method and apparatus
|
