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ASE ASSEMBLY & TEST SHANGHAI LTD

Overview
  • Total Patents
    33
  • GoodIP Patent Rank
    176,847
  • Filing trend
    ⇩ 100.0%
About

ASE ASSEMBLY & TEST SHANGHAI LTD has a total of 33 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2008. It filed its patents most often in China. Its main competitors in its focus markets semiconductors and measurement are FEUSTEL FRANK, SEMICON LIGHT CO LTD and MEGICA CORP.

Patent filings in countries

World map showing ASE ASSEMBLY & TEST SHANGHAI LTDs patent filings in countries
# Country Total Patents
#1 China 33

Patent filings per year

Chart showing ASE ASSEMBLY & TEST SHANGHAI LTDs patent filings per year from 1900 to 2020

Focus industries

Focus technologies

Top inventors

# Name Total Patents
#1 Zhou Sufen 10
#2 Hongda Xu 4
#3 Qisheng Zhong 3
#4 Rui Yu 3
#5 Ruoyu Zhou 2
#6 Dejun Wang 2
#7 Wang Dejun 2
#8 Hengyu Gong 1
#9 Shuqiang Zhang 1
#10 Yandong Wang 1

Latest patents

Publication Filing date Title
CN107229012A Measurement jig and its arrangement method for testing pin hole
CN105355619A Lead frame bar
CN104475354A Visual inspection device for sorting machine
CN104485323A Lead frame and semiconductor packaging body
CN104505379A Lead framework strip and semiconductor packaging body using lead framework strip
CN104505380A Semiconductor packaging body and manufacturing method thereof
CN104465599A Wire frame bar and semiconductor packaging body using same
CN104505378A Lead frame and semiconductor package
CN103715163A Lead frame and semiconductor encapsulation
CN103715162A Lead frame strip used for semi-conductor packaging
CN103227162A Wire frame and packaging structure thereof
CN103178041A Lead frame strip and glue sealing method
CN103066047A Lead frame strip and packaging method for semiconductor packing
CN103050472A Lead frame bar for semiconductor packaging, and mold and adhesive sealing method thereof
CN103021997A Lead support frame, packager and packaging method
CN102074517A Ball grid array (BGA) package structure
CN102044445A Method for manufacturing lead frame of no-lead semiconductor package (QFN)
CN101866867A Manufacturing method for lead frame of semiconductor packaging structure with no outer lead
CN101866902A Semiconductor packaging structure, lead frame and chip holder thereof
CN101894821A Conductor structure for packaging and routing semiconductor and combination structure thereof