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SANDISK INFORMATION TECH SHANGHAI CO LTD

Overview
  • Total Patents
    36
  • GoodIP Patent Rank
    43,922
  • Filing trend
    ⇩ 35.0%
About

SANDISK INFORMATION TECH SHANGHAI CO LTD has a total of 36 patent applications. It decreased the IP activity by 35.0%. Its first patent ever was published in 2013. It filed its patents most often in China, United States and Republic of Korea. Its main competitors in its focus markets semiconductors, electrical machinery and energy and telecommunications are J DEVICES:KK, CHI HEEJO and ASAT LTD.

Patent filings in countries

World map showing SANDISK INFORMATION TECH SHANGHAI CO LTDs patent filings in countries
# Country Total Patents
#1 China 17
#2 United States 11
#3 Republic of Korea 8

Patent filings per year

Chart showing SANDISK INFORMATION TECH SHANGHAI CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Takiar Hem 11
#2 Chiu Chin Tien 11
#3 Chiu Chin-Tien 8
#4 Qiu Jintian 7
#5 Liu Yangming 6
#6 Chin-Tien Chiu 5
#7 Zhou Zengyu 5
#8 Bai Ye 4
#9 Hem Takiar 4
#10 Zhang Cong 4

Latest patents

Publication Filing date Title
CN110660775A Semiconductor device including through-hole in mold pillar
CN110660773A Semiconductor product substrate comprising stress relief layer
CN110660747A Semiconductor device including reinforced corner support
CN110444528A Semiconductor device comprising illusory pull-down wire bonding
CN109979911A The semiconductor device of stack of wafers stack comprising optics connection
CN109950250A With the cooling data center's 3D solid-state driving of matrix
CN109950209A The semiconductor storage cube of side wall flatness with enhancing
CN109216292A Semiconductor device comprising reducing the control switch of stitch capacitor
CN108933109A The semiconductor devices of angled naked core
CN108695284A Include the semiconductor equipment of Top-down design semiconductor package body group
US2017110383A1 Semiconductor device including electromagnetic absorption and shielding
CN108206161A Include the semiconductor device of corner recess
CN107994011A The method of semiconductor package body and manufacture semiconductor package body
CN107993997A Semiconductor devices
CN107706170A Vertical semiconductor device
CN107611099A Semiconductor device is fanned out to including multiple semiconductor bare chips
CN107579061A The semiconductor device of superposition packaging body comprising interconnection