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CARSEM M SDN BHD

Overview
  • Total Patents
    46
  • GoodIP Patent Rank
    185,652
  • Filing trend
    ⇩ 50.0%
About

CARSEM M SDN BHD has a total of 46 patent applications. It decreased the IP activity by 50.0%. Its first patent ever was published in 2000. It filed its patents most often in United States, Malaysia and China. Its main competitors in its focus markets semiconductors, machines and computer technology are KOBAYAKAWA MASAHIKO, CHEN MENG-TSE and LIN JING-CHENG.

Patent filings in countries

World map showing CARSEM M SDN BHDs patent filings in countries

Patent filings per year

Chart showing CARSEM M SDN BHDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Khor Lily 11
#2 Meng Chan Boon 7
#3 Heng Wong Chee 5
#4 Chuan Lau Kam 5
#5 Siang Goh Kok 5
#6 Huat Lee Kock 4
#7 Har Liew Siew 4
#8 Sang Yip Chee 4
#9 Ling Law Wai 4
#10 Tuck Cheong Mun 4

Latest patents

Publication Filing date Title
US2020219800A1 Molded integrated circuit packages
US2018150673A1 Low-profile electronic package
US2017256518A1 Flexible window clamp
CN104851858A Stacked electronic packages
US2015179553A1 Pre-molded integrated circuit packages
US2015087087A1 Color yield of white LEDs
US2013307148A1 Low loop wire bonding
US2014021491A1 Multi-compound molding
MY156107A Large panel leadframe
CN102544340A Leadframe package with recessed cavity for led
MY152355A Short and low loop wire bonding
MY165857A Short and low loop wire bonding
MY165522A Leadframe packagewith die mounted on pedetal that isolates leads
MY149251A Wafer-level package using stud bump coated with solder
MY149211A Laylanding wire bonds
MY154596A Thin plastic leadless package with exposed metal die paddle
MY151606A Slant vision system
MY142210A Multiple row exposed leads for mlp high density packages
US2006148127A1 Method of manufacturing a cavity package
US2005287715A1 Method for encapsulating lead frame packages