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SMIC CHANGDIAN SEMICONDUCTOR (JIANGYIN) CO LTD

Overview
  • Total Patents
    11
  • GoodIP Patent Rank
    159,418
  • Filing trend
    ⇩ 100.0%
About

SMIC CHANGDIAN SEMICONDUCTOR (JIANGYIN) CO LTD has a total of 11 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2015. It filed its patents most often in China. Its main competitors in its focus markets semiconductors and surface technology and coating are LBSEMICON CO LTD, ADL ENGINEERING INC and UTAC THAI LTD.

Patent filings in countries

World map showing SMIC CHANGDIAN SEMICONDUCTOR (JIANGYIN) CO LTDs patent filings in countries
# Country Total Patents
#1 China 11

Patent filings per year

Chart showing SMIC CHANGDIAN SEMICONDUCTOR (JIANGYIN) CO LTDs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Lin Zhengzhong 11
#2 Cai Qifeng 4
#3 Qiu Yuedong 4
#4 He Zhihong 3
#5 Tang Hong 2
#6 Lin Zhangshen 1
#7 Chou Yuedong 1

Latest patents

Publication Filing date Title
CN106783778A Capsulation material via and its fill method
CN106783644A A kind of two-sided fan-out-type wafer-level packaging method and encapsulating structure
CN106783649A A kind of method for packing of integrated electric power system packaging part
CN106206333A A kind of fan-out-type wafer-level packaging method
CN105938804A Wafer level chip scale packaging method and package
CN105810592A Copper needle structure used for stacking type packaging and preparation method therefor
CN105810593A Fan-out type packaging structure and packaging method therefor
CN105719978A Near-distance copper needle packaging structure and preparation method thereof
CN105489516A Packaging method of fan-out type chip, and packaging structure
CN105448755A A packaging method for copper column salient points and a packaging structure
CN106548973A Fan-out-type wafer-level packaging method