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SFA SEMICON CO LTD

Overview
  • Total Patents
    54
  • GoodIP Patent Rank
    27,439
About

SFA SEMICON CO LTD has a total of 54 patent applications. Its first patent ever was published in 2014. It filed its patents most often in Republic of Korea and United States. Its main competitors in its focus markets semiconductors, electrical machinery and energy and optics are FEUSTEL FRANK, ASE ASSEMBLY & TEST SHANGHAI LTD and FUPO ELECTRONICS CORP.

Patent filings in countries

World map showing SFA SEMICON CO LTDs patent filings in countries
# Country Total Patents
#1 Republic of Korea 52
#2 United States 2

Patent filings per year

Chart showing SFA SEMICON CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kim Eun Dong 24
#2 Choi Jai Kyoung 21
#3 Lee Jong Won 20
#4 Jung Hyun Hak 13
#5 Oh You Jin 11
#6 Yu Bong Seok 9
#7 Jeong Byeong Ho 5
#8 Lim Su Kyung 4
#9 Yoo Jae Bok 4
#10 Kim Young Kwon 3

Latest patents

Publication Filing date Title
KR102233649B1 Stacked semiconductor package and manufacturing method of the same
KR102055596B1 Movable apparatus for transporting goods
KR20180076156A Semiconductor package and method for manufacturing the same
KR20180076155A Stack coil of actuator and method for manufacturing the same
US2017125369A1 Semiconductor package and method for manufacturing the same
KR101761588B1 Wafer level package and method of manufaturing the same
KR20170111130A Semiconductor material treatment apparatus and semiconductor manufacturing method for using it
KR20170103501A Semiconductor package and manufacturing thereof
KR20170103533A Semiconductor chip structures, semiconductor package and manufacturing thereof
KR20170103203A Semi conductor package and method thereof
KR20170099514A Embedded mold type coreless substrate and manufacturing method thereof, and semiconductor package having the same
KR20170099503A Block for fixing semiconductor device, apparatus for attaching lid to semiconductor device having the same and method for attaching lid to semiconductor device
KR20170099515A Semiconductor package and method of forming the same
KR20170099513A Semiconductor package and method for manufacturing the same
KR101748132B1 Method for manufacturing shielding and system in package thereby
KR20170092274A Method for manufacturing semiconductor package for package on package and stacked semiconductor package
KR20170090126A Method for manufacturing coil of voice coil motor using through-silicon via and the coil manufactured by the same
KR101734383B1 method for manufacturing semiconductor test socket
KR20170082848A Wafer level fan out package and method for manufacturing the same
KR101748278B1 Method for encapsulating