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CN110690130A
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Three-dimensional heterogeneous stacking method
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Three-dimensional heterogeneous welding method with large bonding force
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Elbow interconnecting metal filling method
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Three-dimensional heterogeneous stacking method with anti-overflow tin structure
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A kind of big flow liquid cooling heat radiator and preparation method thereof for system class large power mould group
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A kind of TSV structure and preparation method thereof of embolism interconnection type
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A kind of big interim bonding method of salient point wafer in surface
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A kind of phase-change heat sink production method for radio frequency microsystem assembly
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A kind of double-deck phase-change heat sink and preparation method thereof for large power assembly in radio frequency micro-system
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A kind of hermetic type system-level photoelectric module packaged type and technique
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A kind of hermetic type radio frequency chip packaging technology based on flexible circuit board
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A kind of test mode of radio frequency chip system in package mould group
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A kind of side heat radiating type radio frequency chip system in package technique
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CN110010501A
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A kind of Anti-radiation type system in package optical-electric module technique
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A kind of radio frequency chip electromagnetic shielding packaging technology of wafer scale
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A kind of radio frequency chip fan-out-type system in package technique
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CN110010499A
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A kind of radio frequency chip system in package technique with electro-magnetic screen function
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CN110010476A
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A kind of novel electroplating process for filling hole in system-in-package structure
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CN110010484A
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A kind of radio frequency chip system in package technique of jack type ultra-deep TSV interconnection
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CN110010556A
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A kind of metal does the radio frequency chip system-in-package structure and technique of closed shell
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