NIPPON MICROMETAL CORP innovation strategy

Patent filings in countries

#	Country	Total Patents
#1	Japan	31
#2	Taiwan	29
#3	Republic of Korea	27
#4	United States	22
#5	WIPO (World Intellectual Property Organization)	22
#6	China	20
#7	EPO (European Patent Office)	13
#8	Singapore	13
#9	Malaysia	7
#10	Philippines	6

#	Industry
#1	Semiconductors
#2	Materials and metallurgy
#3	Machine tools
#4	Surface technology and coating
#5	Machines
#6	Transport
#7	Electrical machinery and energy

#	Technology
#1	Semiconductor devices
#2	Alloys
#3	Soldering, welding and flame cutting
#4	Layered products
#5	Unspecified technologies
#6	Coating metallic material
#7	Changing non-ferrous metals
#8	Vehicle wheels
#9	Making metal sheets
#10	Cables and insulators

Publication	Filing date	Title
WO2021065551A1	2020-09-17	Al wiring material
WO2020184655A1	2020-03-12	Al BONDING WIRE
TW202045742A	2020-03-12	Bonding wire
JP2020059886A	2018-10-10	Al bonding wire
JP2020059882A	2018-10-10	Al bonding wire
US2020373226A1	2017-12-28	Bonding wire for semiconductor device
JP2017073574A	2017-01-25	Bonding wire
JP2018078229A	2016-11-11	Bonding wire for semiconductor device
WO2017221434A1	2016-09-27	Bonding wire for semiconductor device
CN110527864A	2016-09-23	Bonding wire for semiconductor device
WO2016203899A1	2016-05-19	Bonding wire for semiconductor device
EP3147938A1	2015-12-28	Bonding wire for semiconductor device
TWI550639B	2015-09-23	Bonding wire for semiconductor device
WO2016189758A1	2015-09-18	Bonding wire for semiconductor device
MY162884A	2015-09-17	Bonding wire for semiconductor device
WO2016031989A1	2015-08-28	CYLINDRICAL FORMED BODY FOR Cu PILLARS FOR SEMICONDUCTOR CONNECTION
TWI556337B	2015-07-24	Bonding wire for semiconductor device improving the 2nd bonding property of a Pd-plated lead frame, and demonstrating excellent spherical bonding property under high humidity heating conditions
EP3136435A1	2015-07-23	Bonding wire for semiconductor device
CN106489199A	2015-07-22	Bonding wire for semiconductor device
TW201631601A	2015-06-05	Connecting wires for semiconductor devices