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Wire technology co ltd

Overview
  • Total Patents
    21
  • GoodIP Patent Rank
    174,074
About

Wire technology co ltd has a total of 21 patent applications. Its first patent ever was published in 2012. It filed its patents most often in Taiwan, Japan and Republic of Korea. Its main competitors in its focus markets semiconductors, materials and metallurgy and surface technology and coating are AEGIS INC, STRATEDGE CORP and QUANTUM LEAP PACKAGING INC.

Patent filings in countries

World map showing Wire technology co ltds patent filings in countries
# Country Total Patents
#1 Taiwan 13
#2 Japan 3
#3 Republic of Korea 3
#4 China 2

Patent filings per year

Chart showing Wire technology co ltds patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tsai Hsing Hua 12
#2 Lee Jun Der 12
#3 Chuang Tung Han 12
#4 Tsai Hsing-Hua 9
#5 Chuang Tung-Han 6
#6 Lee Jun-Der 4
#7 Li Junde 3
#8 Chuang Chien-Hsun 2
#9 So Tokan 1
#10 Wang Shang-Chih 1

Latest patents

Publication Filing date Title
TWI599664B Metallic ribbon for power module packaging
TWI567842B Graphene coated silver alloy wire and methods for manufacturing the same
TW201534421A Copper bonding wire and methods for manufacturing the same
TW201614745A Bonding wire for power module package and method of manufacturing the same
TW201611187A Method for manufacturing package of power module
TW201604980A Method of forming package structure
TW201527029A Stud bump and package structure thereof and method of forming the same
TW201312716A Stud bump structure and method for forming the same
TW201247904A Ag-based alloy wire and method for manufacturing the same
TW201247903A Electronic package alloy wire and methods for manufacturing the same
TW201336598A Composite wire of silver -gold- palladium alloy coated with metal thin film and method thereof
TW201336599A Composite wire of silver-palladium alloy coated with metal thin film and method thereof