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MICROBONDS INC

Overview
  • Total Patents
    30
About

MICROBONDS INC has a total of 30 patent applications. Its first patent ever was published in 1997. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and EPO (European Patent Office). Its main competitors in its focus markets machine tools, semiconductors and surface technology and coating are HWANG CHIEN LING, ABLEPRINT TECHNOLOGY CO LTD and FASFORD TECHNOLOGY CO LTD.

Patent filings per year

Chart showing MICROBONDS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Song Young-Kyu 16
#2 Lyn Robert 14
#3 Persic John I 13
#4 Lyn Robert J 8
#5 Upshall Morgan Lee 5
#6 Persic John 4
#7 Munar Juan Florencio 4
#8 Wang Daniel 3
#9 Song Young Kyu 2
#10 Upshall Morgan L 1

Latest patents

Publication Filing date Title
US2015322586A1 Bonding wire and process for manufacturing a bonding wire
BR112012019638A2 metal graphic and method for producing a metal graphic
WO2007012187A1 System and method for assembling packaged integrated circuits using insulated wire bond
US2006175712A1 High performance IC package and method
WO2005057653A1 High density integrated circuit package s and method of making same
US7360675B2 Wire bonder for ball bonding insulated wire and method of using same
CA2363409A1 A wire bonder for ball bonding insulated wire and method of using same
WO9826452A1 High density integrated circuits and the method of packaging the same