MICROBONDS INC has a total of 30 patent applications. Its first patent ever was published in 1997. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and EPO (European Patent Office). Its main competitors in its focus markets machine tools, semiconductors and surface technology and coating are HWANG CHIEN LING, ABLEPRINT TECHNOLOGY CO LTD and FASFORD TECHNOLOGY CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 8 | |
#2 | United States | 4 | |
#3 | EPO (European Patent Office) | 3 | |
#4 | Taiwan | 3 | |
#5 | Australia | 2 | |
#6 | Canada | 2 | |
#7 | China | 2 | |
#8 | Republic of Korea | 2 | |
#9 | Brazil | 1 | |
#10 | Israel | 1 | |
#11 | Mexico | 1 | |
#12 | Singapore | 1 |
# | Industry | |
---|---|---|
#1 | Machine tools | |
#2 | Semiconductors | |
#3 | Surface technology and coating | |
#4 | Machines | |
#5 | Audio-visual technology | |
#6 | Consumer goods | |
#7 | Electrical machinery and energy |
# | Name | Total Patents |
---|---|---|
#1 | Song Young-Kyu | 16 |
#2 | Lyn Robert | 14 |
#3 | Persic John I | 13 |
#4 | Lyn Robert J | 8 |
#5 | Upshall Morgan Lee | 5 |
#6 | Persic John | 4 |
#7 | Munar Juan Florencio | 4 |
#8 | Wang Daniel | 3 |
#9 | Song Young Kyu | 2 |
#10 | Upshall Morgan L | 1 |
Publication | Filing date | Title |
---|---|---|
US2015322586A1 | Bonding wire and process for manufacturing a bonding wire | |
BR112012019638A2 | metal graphic and method for producing a metal graphic | |
WO2007012187A1 | System and method for assembling packaged integrated circuits using insulated wire bond | |
US2006175712A1 | High performance IC package and method | |
WO2005057653A1 | High density integrated circuit package s and method of making same | |
US7360675B2 | Wire bonder for ball bonding insulated wire and method of using same | |
CA2363409A1 | A wire bonder for ball bonding insulated wire and method of using same | |
WO9826452A1 | High density integrated circuits and the method of packaging the same |