| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 4 | |
| #2 | United Kingdom | 3 | |
| #3 | EPO (European Patent Office) | 2 | |
| #4 | Japan | 2 | |
| #5 | Germany | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machine tools | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Soldering, welding and flame cutting |
| # | Name | Total Patents |
|---|---|---|
| #1 | Irons Robert Charles | 7 |
| #2 | Billett Kevin Robert | 3 |
| #3 | Evans Michael John | 3 |
| #4 | Neal Howard Donald | 3 |
| #5 | Garrett John Mansell | 2 |
| #6 | Garrett John M | 2 |
| #7 | Chan Stephen | 1 |
| #8 | Ferrando Carlo | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US6678163B1 | Housing for semiconductor chips | |
| EP1168446A2 | Housing semiconductor chips | |
| GB0105732D0 | Housing semiconductor chips | |
| GB0004050D0 | Profiling of semiconductor wafer to prevent edge breakdown |