FASFORD TECHNOLOGY CO LTD has a total of 75 patent applications. It increased the IP activity by 50.0%. Its first patent ever was published in 2012. It filed its patents most often in Taiwan, Japan and Republic of Korea. Its main competitors in its focus markets semiconductors, machines and machine tools are ISOBE ATSUO, MAKI HIROSHI and UNISTARS.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 58 | |
#2 | Japan | 10 | |
#3 | Republic of Korea | 5 | |
#4 | United States | 2 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines | |
#3 | Machine tools | |
#4 | Audio-visual technology | |
#5 | Surface technology and coating | |
#6 | Optics | |
#7 | Control |
# | Name | Total Patents |
---|---|---|
#1 | Maki Hiroshi | 24 |
#2 | Okamoto Naoki | 16 |
#3 | Kobashi Hideharu | 11 |
#4 | Mochizuki Masayuki | 7 |
#5 | Tani Yukio | 7 |
#6 | Ishii Yoshihide | 7 |
#7 | Nakui Yuki | 6 |
#8 | Saito Akira | 6 |
#9 | Takano Ryuichi | 5 |
#10 | Nakano Kazuo | 5 |
Publication | Filing date | Title |
---|---|---|
JP2016040850A | Foreign matter removal device and die bonder having the same | |
JP2015228532A | Die bonder and die bonding method | |
JP2016009848A | Semiconductor or electronic component mounting device and semiconductor or electronic component mounting method | |
JP2015211191A | Die bonder and bonding method | |
JP2015195261A | Die bonder and semiconductor manufacturing method | |
JP2015192075A | die bonder and die bonder adjustment method | |
JP2015179689A | Mounting location correction method of die bonder, die bonder and bonding method | |
JP2015177110A | Die bonder and die bonding method | |
JP2015177038A | Dipping mechanism for die bonder and flip chip bonder | |
JP2015173551A | Semiconductor manufacturing method and die bonder |