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HWANG CHIEN LING

Overview
  • Total Patents
    15
About

HWANG CHIEN LING has a total of 15 patent applications. Its first patent ever was published in 2010. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, machines and surface technology and coating are MAHLER JOACHIM, FAROOQ MUKTA G and FASFORD TECHNOLOGY CO LTD.

Patent filings in countries

World map showing HWANG CHIEN LINGs patent filings in countries
# Country Total Patents
#1 United States 15

Patent filings per year

Chart showing HWANG CHIEN LINGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hwang Chien Ling 15
#2 Liu Chung-Shi 14
#3 Huang Ying-Jui 5
#4 Lin Cheng-Chung 4
#5 Wu Yi-Wen 4
#6 Hsiao Yi-Li 4
#7 Wang Lin-Wei 3
#8 Lim Zheng-Yi 2
#9 Tsai Tsai-Tsung 1
#10 Yu Chen-Hua 1

Latest patents

Publication Filing date Title
US2013167373A1 Apparatus for stud bump formation
US2013273717A1 Apparatus and Method for the Singulation of a Semiconductor Wafer
US2013248119A1 Apparatus and method of separating wafer from carrier
US2013244403A1 Method and device for cutting semiconductor wafers
US2013115752A1 Pick-and-place tool for packaging process
US2012091577A1 Copper pillar bump with cobalt-containing sidewall protection
US2011101521A1 Post passivation interconnect with oxidation prevention layer
US2012088362A1 Thermal compressive bond head
US2011115077A1 Method for reducing voids in a copper-tin interface and structure formed thereby
US8104666B1 Thermal compressive bonding with separate die-attach and reflow processes
US2012007230A1 Method of forming semiconductor die
US2011298123A1 Cu pillar bump with non-metal sidewall spacer and metal top cap
US2011285011A1 Cu pillar bump with L-shaped non-metal sidewall protection structure
US2011233761A1 Cu pillar bump with non-metal sidewall protection structure