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NAT CT FOR ADVANCED PACKAGING

Overview
  • Total Patents
    304
  • GoodIP Patent Rank
    7,013
About

NAT CT FOR ADVANCED PACKAGING has a total of 304 patent applications. Its first patent ever was published in 2010. It filed its patents most often in China, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, optics and audio-visual technology are ZYCUBE CO LTD, AMKOR TECHNOLOGY INC and BARTH HANS-JOACHIM.

Patent filings in countries

World map showing NAT CT FOR ADVANCED PACKAGINGs patent filings in countries

Patent filings per year

Chart showing NAT CT FOR ADVANCED PACKAGINGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhang Wenqi 53
#2 Yu Daquan 48
#3 Sun Peng 38
#4 Lu Yuan 30
#5 Wang Hongjie 29
#6 He Hongwen 27
#7 Jiang Feng 22
#8 Guo Xueping 22
#9 Yu Zhongyao 20
#10 Xu Jian 19

Latest patents

Publication Filing date Title
CN105304598A Vertically-package-over-package multi-chip wafer level packaging structure and manufacturing method thereof
CN105294609A Polyfunctional group low-dielectric epoxy resin monomer and its synthesis method and use
CN105244578A Quasi TEM mode-based glass adaptor plate integrated waveguide and manufacturing method thereof
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CN105244341A Semiconductor device FOWLP packaging structure and manufacturing method thereof
CN105244307A Manufacturing method of fan-out type packaging structure
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CN105047652A Semiconductor device packaging structure and manufacturing method thereof
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CN105137317A Adapter plate technology and structure for quickly testing electric property of wafer
CN105140142A Adapter plate process for sample testing electrical property of wafers
CN105023931A Backside illuminated image chip module structure and fabrication method thereof
CN105140253A Backside illuminated image chip wafer level three-dimensional (3D) stack structure and packaging technology
CN105140200A Fabrication method of wafer level bump package structure
CN105070698A Wafer-level tin soldering dimpling point and manufacturing method thereof
CN105023850A Total-reflection laser bonding disassembling method
CN104952738A Preparation method of organic adapter plates and packaging structure based on adapter plates
CN104952897A WLP (wafer level package) structure capable of reducing stress and applicable to stacked BSI (backside illuminated) image sensor
CN105140252A Wafer-level packaging method of image sensor and packaged product thereof
CN104952720A Method for forming height-controllable exposure of electric-conducting poles from back