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MAHLER JOACHIM

Overview
  • Total Patents
    23
About

MAHLER JOACHIM has a total of 23 patent applications. Its first patent ever was published in 2005. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, machines and surface technology and coating are FAROOQ MUKTA G, LIN MOU-SHIUNG and NIKITIN IVAN.

Patent filings in countries

World map showing MAHLER JOACHIMs patent filings in countries
# Country Total Patents
#1 United States 23

Patent filings per year

Chart showing MAHLER JOACHIMs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Mahler Joachim 23
#2 Hosseini Khalil 8
#3 Fuergut Edward 5
#4 Mengel Manfred 5
#5 Bauer Michael 5
#6 Haimerl Alfred 5
#7 Kessler Angela 4
#8 Schober Wolfgang 3
#9 Kalz Franz-Peter 3
#10 Engl Reimund 2

Latest patents

Publication Filing date Title
US2014076613A1 Method for electrophoretically depositing a film on an electronic assembly
US2014061878A1 Integrated circuits and a method for manufacturing an integrated circuit
US2014027892A1 Electric device package comprising a laminate and method of making an electric device package comprising a laminate
US2014021638A1 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
US2013341778A1 Device contact, electric device package and method of manufacturing an electric device package
US2013277824A1 Semiconductor device including a polymer disposed on a carrier
US2013256855A1 Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package
US2013256856A1 Multichip power semiconductor device
US2013021766A1 Electronic component
US2012327614A1 Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
US2010210071A1 Method of manufacturing semiconductor devices
US2010044841A1 Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier
US2008173992A1 Semiconductor device including isolation layer
US2008142992A1 Molding compound adhesion for map-molded flip-chip