| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 22 | |
| #2 | Taiwan | 3 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Telecommunications | |
| #3 | Environmental technology | |
| #4 | Audio-visual technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Transmission | |
| #3 | Reduction of greenhouse gas emissions | |
| #4 | Casings and printed circuits |
| # | Name | Total Patents |
|---|---|---|
| #1 | Lee Jin-Yuan | 25 |
| #2 | Lin Mou-Shiung | 11 |
| #3 | Huang Ching-Cheng | 9 |
| #4 | Chen Ying-Chih | 4 |
| #5 | Lin Chuen-Jye | 3 |
| #6 | Lei Ming-Ta | 3 |
| #7 | Lin Shih-Hsiung | 2 |
| #8 | Kuo Hsi-Shan | 2 |
| #9 | Chou Chien-Kang | 2 |
| #10 | Lo Hsin-Jung | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2008284014A1 | Chip assembly with interconnection by metal bump | |
| TW200830563A | Photovoltaic device and method of manufacturing the same | |
| US2007210380A1 | Body connection structure for soi mos transistor | |
| US2007090456A1 | Soi device and method for fabricating the same | |
| TWI262591B | Semiconductor-on-insulator dynamic random access memory |