|
CN106784031A
|
|
A kind of packaging part of novel photoelectric sensor
|
|
CN106252306A
|
|
A kind of ultra-thin fingerprint recognition system level packaging part using silicon through hole and naked core plastic packaging
|
|
CN106252305A
|
|
The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting is punched again
|
|
CN106449544A
|
|
Naked-core plastic package ultrathin fingerprint recognition system-level package element capable of grooving first and then punching
|
|
CN106252304A
|
|
A kind of ultra-thin fingerprint recognition system level packaging part using silicon through hole and naked core plastic packaging
|
|
CN106158780A
|
|
The encapsulating structure of a kind of DAF film parcel fingerprint sensor and manufacture method thereof
|
|
CN106098644A
|
|
Chip-packaging structure that a kind of DAF film is combined with cushion block and manufacture method thereof
|
|
CN105977214A
|
|
TSV chip packaging element based on open molding technology and production method thereof
|
|
CN106024731A
|
|
Packaging part capable of preventing plastic packaging material from overflowing out of surface by passivating layer
|
|
CN105977224A
|
|
Encapsulation part surrounding dam structure for preventing from overflowing plastic package material from surface, and manufacturing method thereof
|
|
CN105789158A
|
|
POP packaging part with no need for plastic-sealed body opening and manufacturing technology for POP packaging part
|
|
CN105789151A
|
|
Cutting type multi-circle QFN/DFN packaging part and manufacturing method thereof
|
|
CN105470231A
|
|
Ladder-type framework pin formed by using half-etching process and manufacturing method thereof
|
|
CN105470211A
|
|
Heat sink mounting packaging piece capable of preventing flashing
|
|
CN105489509A
|
|
Optical sensing chip package method for optimizing coating process by applying metal stencil printing technology
|
|
CN105470213A
|
|
Light distance sensor packaging structure formed by once packaging molding and manufacturing method thereof
|
|
CN105470207A
|
|
Fingerprint identification chip packaging structure based on high-flatness substrate and manufacturing method thereof
|
|
CN105448859A
|
|
Packaging part provided with glass cover board on chip and manufacturing method thereof
|
|
CN105470199A
|
|
Separation method for package part with cooling fins
|
|
CN105551973A
|
|
Package added with heat sink and manufacturing method thereof
|
