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JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD

Overview
  • Total Patents
    123
  • GoodIP Patent Rank
    21,297
  • Filing trend
    ⇩ 60.0%
About

JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD has a total of 123 patent applications. It decreased the IP activity by 60.0%. Its first patent ever was published in 2009. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets semiconductors, computer technology and telecommunications are HUATIAN TECH XI AN CO LTD, ENKRIS SEMICONDUCTOR INC and SHANGHAI ZHENXIAN ELECTRONIC TECHNOLOGY CO LTD.

Patent filings in countries

World map showing JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTDs patent filings in countries

Patent filings per year

Chart showing JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chen Jinhui 104
#2 Lai Zhiming 101
#3 Zhang Li 100
#4 Chen Dong 85
#5 Jinhui Chen 17
#6 Li Zhang 17
#7 Zhiming Lai 17
#8 Dong Chen 17
#9 Xu Hong 15
#10 Guo Hongyan 14

Latest patents

Publication Filing date Title
CN112201631A Chip packaging structure and packaging method thereof
CN112216661A Chip packaging structure and packaging method thereof
CN112151472A Chip packaging structure and packaging method thereof
CN111370388A Chip packaging structure and packaging method thereof
CN111477605A Chip packaging structure and packaging method thereof
CN110931459A Chip packaging structure and packaging method thereof
CN110931460A Chip packaging structure and packaging method thereof
CN110931458A Chip packaging structure and packaging method thereof
CN110880482A Chip packaging structure and packaging method thereof
CN110808230A Packaging structure of six-surface coated core plate size and packaging method thereof
CN110797325A Packaging structure with electromagnetic shielding function and packaging method thereof
CN110890285A Chip package packaging structure and packaging method thereof
CN109244231A A kind of encapsulating structure and its packaging method of sound surface filtering chip
CN109411597A A kind of encapsulating structure and its packaging method of sound surface filtering chip
CN109244230A A kind of encapsulating structure and its packaging method of sound surface filtering chip
CN108511401A A kind of encapsulating structure and its packaging method of semiconductor chip
CN107946260A A kind of wafer level cladded type chip-packaging structure and its method for packing
CN107919333A A kind of three-dimensional POP encapsulating structures and its method for packing
CN107946251A A kind of method for packing of semiconductor product
CN107910310A A kind of multi-chip fan-out package structure and its method for packing