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HUATIAN TECH XI AN CO LTD

Overview
  • Total Patents
    101
  • GoodIP Patent Rank
    40,604
About

HUATIAN TECH XI AN CO LTD has a total of 101 patent applications. Its first patent ever was published in 2012. It filed its patents most often in China. Its main competitors in its focus markets semiconductors and computer technology are KAIXIN INC, SMIC CHANGDIAN SEMICONDUCTOR JIANGYIN CO LTD and YINGXINDA CO LTD.

Patent filings in countries

World map showing HUATIAN TECH XI AN CO LTDs patent filings in countries
# Country Total Patents
#1 China 101

Patent filings per year

Chart showing HUATIAN TECH XI AN CO LTDs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Cui Meng 40
#2 Guo Xiaowei 26
#3 Xie Jianyou 26
#4 Wang Hu 26
#5 Liu Weidong 23
#6 Shen Shiguang 23
#7 Li Wanxia 22
#8 Yu Daquan 21
#9 Wei Haidong 18
#10 Li Taotao 16

Latest patents

Publication Filing date Title
CN105304575A Packaging structure adopting cushion block to prevent inclination of fingerprint sensing chip and manufacturing method
CN105047621A Sensing chip packaging structure and preparation method thereof
CN104811889A MEMS microphone packaging device and assembling method thereof
CN104576594A Fingerprint design packaging structure through dispensing technology and preparation method thereof
CN104681533A Substrate groove-based chip integrated fingerprint identification sensor and manufacturing method thereof
CN104538379A Fingerprint designing and packaging structure based on partial encapsulation technology and preparing method thereof
CN104484660A Chip-integrated fingerprint identification sensor and manufacturing method thereof
CN104538377A Fan-out packaging structure based on carrier and preparation method of fan-out packaging structure
CN104505381A Lead frame of cavity carrier structure
CN104538381A Package structure with bare flip chip by using films and preparation method thereof
CN104485320A Embedded sensing chip encapsulation structure with vertical through hole and manufacturing method thereof
CN104538370A POP packaging structure based on reserved groove plastic packaging technology and preparation method of POP packaging structure
CN104485312A Substrate capable of overcoming peripheral material overflowing of MUF technology substrate and manufacturing method of substrate capable of overcoming peripheral material overflowing of MUF technology substrate
CN104538375A Fan-out PoP packaging structure and manufacturing method thereof
CN104659004A Pop structure and manufacture method thereof
CN104505384A Bonding wire embedding fan-in type packaging part and production method thereof
CN104505382A Wafer-level fan-out PoP encapsulation structure and making method thereof
CN104658933A POP structure applying lamination process and preparation method thereof
CN104576608A Membrane plastic-packaged POP structure and preparation method thereof
CN104733411A Three-dimensional wafer level fan-out package-on-package (PoP) structure and manufacturing method thereof