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BREWER SCIENCE INC

Overview
  • Total Patents
    683
  • GoodIP Patent Rank
    11,232
  • Filing trend
    ⇩ 43.0%
About

BREWER SCIENCE INC has a total of 683 patent applications. It decreased the IP activity by 43.0%. Its first patent ever was published in 1984. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets optics, machines and semiconductors are SUESS MICROTEC LITHOGRAPHY, YAMAMOTO TARO and AZ ELECTRONIC MATERIALS KK.

Patent filings per year

Chart showing BREWER SCIENCE INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Flaim Tony D 144
#2 Puligadda Rama 84
#3 Guerrero Douglas J 71
#4 Krishnamurthy Vandana 54
#5 Zhong Xing-Fu 49
#6 Shao Xie 46
#7 Xu Gu 38
#8 Meador Jim D 38
#9 Neef Charles J 35
#10 Wang Yubao 35

Latest patents

Publication Filing date Title
WO2021081482A1 High-silicon-content wet-removable planarizing layer
WO2021035108A1 Underlayers for euv lithography
WO2021026035A1 Permanent bonding and patterning material
US2021082683A1 Selective liquiphobic surface modification of substrates
US2020257202A1 Poly(cyanocinnamate)s for structural and optical applications
WO2020154225A1 Laser-releasable bonding materials for 3-d ic applications
WO2020092963A1 Bottom-up conformal coating and photopatterning on pag-immobilized surfaces
EP3807721A1 Adhesion layers for euv lithography
KR20200092349A Laser-separable adhesive material for 3-D IC applications
US2019233636A1 Gradient block copolymers for directed self-assembly
US2019036246A1 Environmentally sealed, reusable connector for printed flexible electronics
US2018254189A1 High-chi block copolymers with tunable glass transition temperatures for directed self-assembly
WO2018112121A1 High-chi block copolymers for directed self-assembly
WO2018067671A1 Chemically patterned guide layers for use in chemoepitaxy directing of block co-polymers
TW201816365A Energetic pulse clearing of environmentally sensitive thin-film devices
US2018063963A1 Polymer film stencil process for fan-out wafer-level packaging of semiconductor devices
CN109716485A Laser ablation dielectric material
US2017040200A1 Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
EP3332225A1 Environmental sensor system and signal processor
CN107787520A Hyperplane spin coating carbon material