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THALLNER ERICH

Overview
  • Total Patents
    153
  • GoodIP Patent Rank
    133,821
About

THALLNER ERICH has a total of 153 patent applications. Its first patent ever was published in 1987. It filed its patents most often in United States, Austria and Germany. Its main competitors in its focus markets semiconductors, machines and optics are SUSS MICROTEC INC, DNS KOREA CO LTD and RYODEN SEMICONDUCTOR SYST ENG.

Patent filings per year

Chart showing THALLNER ERICHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Thallner Erich 118
#2 Thanner Christine 3
#3 Mittendorfer Gerald 3
#4 Thallner Erich Dipl Ing 3
#5 Thallner Erich Dipl-Ing 2
#6 Erich Thallner 2
#7 Kast Michael 1
#8 Hangweier Peter-Oliver 1
#9 Christine Tanner 1
#10 Erich Dipl Ing Thallner 1

Latest patents

Publication Filing date Title
AT517197A1 Pressure plate for bonding wafers
US2017133243A1 Sample holder, device and method for detaching of a first substrate
AT517646A5 Substrate composite, method and apparatus for bonding substrates
KR20150023376A Device and method for aligning substrates
KR20150023360A Substrate-product substrate combination and device and method for producing a substrate-product substrate combination
AT511384A1 Process and device for bonding two wafer
AT509562A1 Lighting device and method for producing such a
DE102008045120A1 Robotic vehicle cleaning device system
DE102008018536A1 Device and method for applying and / or detaching a wafer to / from a carrier
JP2008262676A Method and device for producing a nanopatterned disc
DE102007022895A1 Device for transferring structures provided in a mask onto a substrate
DE102007019268A1 Apparatus for printing and / or embossing substrates
US2007210460A1 Substrate processing and alignment
JP2007260895A Apparatus and method of coating micro-structured and/or nano-structured structural substrate
DE102006058493A1 Method and apparatus for bonding wafers
DE102006031434A1 Handling device and handling method for wafers
DE102006026331A1 Transportable unit for transporting wafers and using a gel film in a transportable unit
US2007237897A1 Device and method for coating a microstructured and/or nanostructured structural substrate
EP1840940A1 Apparatus and process for coating micro or nanostructured substrates
EP1832933A1 Device manufacturing method and substrate processing apparatus, and substrate support structure