| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Republic of Korea | 4 | |
| #2 | Japan | 2 | |
| #3 | WIPO (World Intellectual Property Organization) | 2 | |
| #4 | China | 1 | |
| #5 | EPO (European Patent Office) | 1 | |
| #6 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Surface technology and coating | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Layered products | |
| #3 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Tang Hao | 10 |
| #2 | Yin Ming | 3 |
| #3 | Zeng Yushen | 2 |
| #4 | Zhang Wei | 1 |
| #5 | Hao Tang | 1 |
| #6 | Zhang Zhoujie | 1 |
| Publication | Filing date | Title |
|---|---|---|
| KR20170047176A | A procedure of processing a workpiece and an apparatus designed for the precedure | |
| US2018108558A1 | Wafer de-bonding device | |
| KR20170003934A | Method for cutting wafer using mechanical cutting tool |