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ARCH SPEC CHEM INC

Overview
  • Total Patents
    213
About

ARCH SPEC CHEM INC has a total of 213 patent applications. Its first patent ever was published in 1992. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets optics, macromolecular chemistry and polymers and basic materials chemistry are FUJIFILM ELECTRONIC MATERIALS, YOUNG CHANG CHEMICAL CO LTD and OCG MICROELECTRONICS INC.

Patent filings per year

Chart showing ARCH SPEC CHEM INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Weber William D 46
#2 Blakeney Andrew J 44
#3 Malik Sanjay 38
#4 Waterson Pamela J 33
#5 Honda Kenji 33
#6 Naiini Ahmad A 26
#7 Naiini Ahmad 25
#8 Foster Patrick 21
#9 Ferreira Lawrence 20
#10 Biafore John Joseph 18

Latest patents

Publication Filing date Title
TW200510570A Novel aqueous based metal etchant
WO2005022257A2 Novel photosensitive bilayer composition
WO2005000912A2 Novel positive photosensitive resin compositions
US2004249110A1 Photosensitive resin compositions
US2004229166A1 Photosensitive resin compositions
WO2004081663A2 Novel photosensitive resin compositions
US2004161711A1 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems
US2004161619A1 Process for producing a heat resistant relief structure
US2004159050A1 Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
TW200413417A Novel copolymer, photoresist compositions thereof and deep UV bilayer system thereof
WO2004027518A2 A method for the removal of an imaging layer from a semiconductor substrate stack
US2004127070A1 Additives to prevent degradation of alkyl-hydrogen siloxanes
WO2004002955A2 Photosensitive compositions
TW200307175A Acetal protected polymers and photoresist compositions thereof
US2003204035A1 Thermally cured underlayer for lithographic application
WO03080688A1 A novel process for producing anhydride-containing polymers for radiation sensitive compositions
TW200416490A Improved semiconductor stress buffer coating edge bead removal compositions and method for their use
WO03067631A2 Improved semiconductor stress buffer coating edge bead removal compositions and method for their use
WO03021357A1 Free-acid containing polymers and their use in photoresists
US2003037836A1 Automatic refill system for ultra pure or contamination sensitive chemicals