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FUJIFILM ELECTRONIC MATERIALS

Overview
  • Total Patents
    242
  • GoodIP Patent Rank
    67,598
About

FUJIFILM ELECTRONIC MATERIALS has a total of 242 patent applications. Its first patent ever was published in 1999. It filed its patents most often in Republic of Korea, EPO (European Patent Office) and Japan. Its main competitors in its focus markets optics, semiconductors and machines are YOUNG CHANG CHEMICAL CO LTD, TOKYO OHKA KOGYO CO LTD and BAE YOUNG CHEOL.

Patent filings per year

Chart showing FUJIFILM ELECTRONIC MATERIALSs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Naiini Ahmad A 55
#2 Powell David B 32
#3 Malik Sanjay 31
#4 Hopla Richard 31
#5 De Binod B 30
#6 Weber William D 23
#7 Teff Daniel J 21
#8 Chagolla John L 21
#9 Takahashi Tomonori 20
#10 Rushkin Il Ya 20

Latest patents

Publication Filing date Title
CN105093862A Surface active agent and developing solution used for color filter negative photoresist
CN104907298A Super-clean IBC bucket washing device
WO2015116657A1 Novel polyimide compositions
KR20160097201A Cleaning formulation for removing residues on surfaces
KR20160096095A Cleaning formulation for removing residues on surfaces
CN103955122A Developing solution for color filter
CN103955121A Developing solution for color filter
CN103955119A Developing solution in semiconductor integrated circuit
CN103955120A Developing solution for semiconductor integrated circuit
CN103434937A Safety interlock device for lifting of dangerous chemicals
CN103447273A Washing device for developing solution storage bottle
CN103466170A Sealed dichloroethylene storage bottle
US2014073140A1 Etching composition
SG192574A1 Novel etching composition
TW201106101A Chemically amplified positive photoresist composition
KR20110105002A Nonpolymeric binders for semiconductor substrate coatings
US2009291210A1 Additives to prevent degradation of cyclic alkene derivatives
WO2009099954A1 Novel positive photosensitive resin compositions
WO2009052177A1 Novel photosensitive resin compositions
TW200900862A Thermally cured underlayer for lithographic application