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WO9942903A1
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RADIATION SENSITIVE TERPOLYMER, PHOTORESIST COMPOSITIONS THEREOF AND 193 nm BILAYER SYSTEMS
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WO9913381A1
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A negatively acting photoresist composition based on polyimide precursors
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US6030932A
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Cleaning composition and method for removing residues
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US5985507A
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Selected high thermal novolaks and positive-working radiation-sensitive compositions
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US6040107A
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Photosensitive diazonaphthoquinone esters based on selected cyclic alkyl ether-containing phenolics and their use in radiation sensitive mixtures
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US6027853A
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Process for preparing a radiation-sensitive composition
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US5977041A
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Aqueous rinsing composition
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US6033993A
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Process for removing residues from a semiconductor substrate
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EP0819982A1
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Radiation-sensitive composition
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US5798323A
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Non-corrosive stripping and cleaning composition
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US5789525A
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Process for making polyimides from diamines and tetracarboxylic diacid diester
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US5834581A
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Process for making polyimide-polyamic ester copolymers
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US5789524A
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Chemical imidization reagent for polyimide synthesis
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US5856065A
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Negative working photoresist composition based on polyimide primers
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US5674657A
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Positive-working photoresist compositions comprising an alkali-soluble novolak resin made with four phenolic monomers
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US5817610A
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Non-corrosive cleaning composition for removing plasma etching residues
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US5759973A
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Photoresist stripping and cleaning compositions
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US5886119A
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Terpolymers containing organosilicon side chains
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EP0718317A2
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Photoresist compositions
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US5612304A
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Redox reagent-containing post-etch residue cleaning composition
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