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YU CHEN-HUA

Overview
  • Total Patents
    97
About

YU CHEN-HUA has a total of 97 patent applications. Its first patent ever was published in 2006. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, machines and optics are SIRINORAKUL SARAVUTH, BOBDE MADHUR and XUE YAN XUN.

Patent filings in countries

World map showing YU CHEN-HUAs patent filings in countries
# Country Total Patents
#1 United States 97

Patent filings per year

Chart showing YU CHEN-HUAs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yu Chen-Hua 97
#2 Chiou Wen-Chih 28
#3 Chen Ding-Yuan 17
#4 Yu Chia-Lin 13
#5 Lii Mirng-Ji 11
#6 Jeng Shin-Puu 8
#7 Lin Hung-Ta 8
#8 Lin Jing-Cheng 8
#9 Yeh Chen-Nan 8
#10 Liu Chung-Shi 7

Latest patents

Publication Filing date Title
US2014054760A1 Package-on-package semiconductor device
US2014220494A1 Pattern generator for a lithography system
US2013270702A1 Copper interconnect structure and method for forming the same
US2014042643A1 Interposer system and method
US8642393B1 Package on Package Devices and Methods of Forming Same
US2014027872A1 CIS chips and methods for forming the same
US2014021614A1 Hybrid interconnect scheme including aluminum metal line in low-k dielectric
US2014021605A1 Package on package devices and methods of packaging semiconductor dies
US2014015086A1 Interconnect structure for CIS flip-chip bonding and methods for forming the same
US2013307144A1 Three-dimensional chip stack and method of forming the same
US2014001612A1 Multiple die packaging interposer structure and method
US2014001644A1 Package structures and methods for forming the same
US2013264684A1 Methods and apparatus of wafer level package for heterogeneous integration technology
US2013270700A1 Package on package structures and methods for forming the same
US2013320225A1 Devices and methods for improved reflective electron beam lithography
US2013105979A1 Package on package devices and methods of packaging semiconductor dies
US2013168805A1 Packages with passive devices and methods of forming the same
US2013285237A1 Low profile interposer with stud structure
US2013277838A1 Methods and apparatus for solder connections
US2013187270A1 Multi-chip fan out package and methods of forming the same