| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 13 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Optics | |
| #4 | Audio-visual technology | |
| #5 | Measurement |
| # | Name | Total Patents |
|---|---|---|
| #1 | Wood Alan G | 13 |
| #2 | Hembree David R | 6 |
| #3 | Hiatt William M | 4 |
| #4 | Rigg Sidney B | 3 |
| #5 | Kirby Kyle K | 3 |
| #6 | Benson Peter | 3 |
| #7 | Farnworth Warren M | 3 |
| #8 | Akram Salman | 3 |
| #9 | Grigg Ford B | 2 |
| #10 | Corbett Tim | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US2012306084A1 | Methods of forming through-substrate interconnects | |
| US2010264423A1 | Methods for fabricating semiconductor components using thinning and back side laser processing | |
| US2010252915A1 | Microelectronic device wafers and methods of manufacturing |