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ST ASSEMBLY TEST SERVICES PTE

Overview
  • Total Patents
    38
About

ST ASSEMBLY TEST SERVICES PTE has a total of 38 patent applications. Its first patent ever was published in 1998. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, audio-visual technology and machines are ANAM IND CO INC, TESSERA INC and VISWANATHAN LAKSHMINARAYAN.

Patent filings in countries

World map showing ST ASSEMBLY TEST SERVICES PTEs patent filings in countries
# Country Total Patents
#1 United States 38

Patent filings per year

Chart showing ST ASSEMBLY TEST SERVICES PTEs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Briar John 10
#2 Shim Il Kwon 7
#3 Tan Chee-Keong 5
#4 Camenforte Raymundo M 4
#5 Apale Hermes T 4
#6 Balanon Gerry 3
#7 Yap Liop Jin 3
#8 Wee Hwee Nam 2
#9 Mehta Rajiv 2
#10 Chong Sean Shiao Shiong 2

Latest patents

Publication Filing date Title
US2004108601A1 Mold cap anchoring method for molded flex BGA packages
US2004079788A1 Cost effective substrate fabrication for flip-chip packages
US2004061202A1 Leadframe for die stacking applications and related die stacking concepts
US2004036068A1 Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration
US2003219966A1 Method of forming a small pitch torch bump for mounting high-performance flip-flop devices
US2003197195A1 Heat spreader interconnect methodology for thermally enhanced PBGA packages
US2003140475A1 Multi-package conversion kit for a pick and place handler
US6380048B1 Die paddle enhancement for exposed pad in semiconductor packaging
US6278613B1 Copper pads for heat spreader attach
US6660565B1 Flip chip molded/exposed die process and package structure
US6432742B1 Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages
US6403401B1 Heat spreader hole pin 1 identifier
US6284572B1 Boat and assembly method for ball grid array packages
US6383303B1 High volume fluid head
US6282812B1 Multi air-knife box and method of use
US6319418B1 Zig-zagged plating bus lines
US6255143B1 Flip chip thermally enhanced ball grid array
US6184047B1 Contactor sleeve assembly for a pick and place semiconductor device handler
US6176066B1 Hook and loop fastener strapping for semiconductor carrying trays
US6404212B1 Testing of BGA and other CSP packages using probing techniques