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SH MATERIALS CO LTD

Overview
  • Total Patents
    203
  • GoodIP Patent Rank
    7,969
  • Filing trend
    ⇩ 79.0%
About

SH MATERIALS CO LTD has a total of 203 patent applications. It decreased the IP activity by 79.0%. Its first patent ever was published in 2011. It filed its patents most often in Japan, China and Taiwan. Its main competitors in its focus markets semiconductors, audio-visual technology and optics are PHOENIX PREC TECHNOLOGY, CHANDRASEKARAN ARVIND and OHKUCHI MATERIALS CO LTD.

Patent filings in countries

World map showing SH MATERIALS CO LTDs patent filings in countries
# Country Total Patents
#1 Japan 131
#2 China 25
#3 Taiwan 17
#4 Republic of Korea 11
#5 WIPO (World Intellectual Property Organization) 11
#6 United States 6
#7 Philippines 2

Patent filings per year

Chart showing SH MATERIALS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hishiki Kaoru 44
#2 Iitani Kazunori 31
#3 Saisho Shigeru 19
#4 Kubota Satoshi 16
#5 Arima Hiroyuki 12
#6 Hosomomi Shigeru 12
#7 Iidani Ichinori 12
#8 Yoshimoto Ryouichi 9
#9 Kidoguchi Shunichi 9
#10 Takahashi Toshihiro 8

Latest patents

Publication Filing date Title
JP2018129331A Lead frame, and method for manufacturing lead frame
JP2018129332A Lead frame, and manufacturing method of lead frame
JP2018117031A Manufacturing method of lead frame
JP2018083220A Progressive metal mold, and method for manufacturing lead frame
JP2018083250A Method for manufacturing metal mold and metal mold
JP2018073893A Manufacturing apparatus of lead frame, progressive transfer mold, and manufacturing method of lead frame
JP2018069251A Metal mold for punching, punching method, and method for manufacturing lead frame
JP2018056386A Lead frame
JP2018037535A Surface roughening method of lead frame, and method for producing lead frame having roughened surface using the same
JP2018022817A Lead frame, resin-attached lead frame, optical semiconductor device, and method for manufacturing lead frame
JP2018018937A Wiring member for multi-array type led, and manufacturing method of the same
JP2018018864A Semiconductor element mounting substrate, semiconductor device, and manufacturing method thereof
JP2018014352A Lead frame, lead frame with resin, optical semiconductor device, and method of manufacturing lead frame
JP2017216364A Wiring member for multi-row type semiconductor device, and method of manufacturing the same
JP2017216366A Wiring member for multi-row type semiconductor device, and method of manufacturing the same
JP2017216365A Wiring member for multi-row type semiconductor device, and method of manufacturing the same
JP2017212290A Lead frame for optical semiconductor device, lead frame with resin and optical semiconductor device, and manufacturing methods of them
JP2017208514A Wiring member for multi-row type semiconductor device, and method of manufacturing the same
JP2017208516A Wiring member for multi-row type semiconductor device, and method of manufacturing the same
JP2017208515A Wiring member for multi-row type semiconductor device, and method of manufacturing the same