US2012225522A1
|
|
Package 3D interconnection and method of making same
|
US2013221500A1
|
|
System-in-package with integrated socket
|
US2013221506A1
|
|
Semiconductor packages with integrated heat spreaders
|
US2013221525A1
|
|
Semiconductor package with integrated selectively conductive film interposer
|
US2013214408A1
|
|
Interposer Having Conductive Posts
|
US2013193996A1
|
|
Semiconductor package with improved testability
|
US2013168841A1
|
|
Programmable interposer with conductive particles
|
US2013082363A1
|
|
Device having wirelessly enabled functional blocks
|
US2013078915A1
|
|
Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding
|
US2012314367A1
|
|
Methods and systems for on-chip osmotic airflow cooling
|
US2012212244A1
|
|
Test board for use with devices having wirelessly enabled functional blocks and method of using same
|
US2012086114A1
|
|
Millimeter devices on an integrated circuit
|
US2011316139A1
|
|
Package for a wireless enabled integrated circuit
|
US2012126396A1
|
|
Die down device with thermal connector
|
US2011176279A1
|
|
Electromagnetic interference shield with integrated heat sink
|
US2009051010A1
|
|
IC package sacrificial structures for crack propagation confinement
|
US2007290376A1
|
|
Integrated circuit (IC) package stacking and IC packages formed by same
|
US2007290322A1
|
|
Thermal improvement for hotspots on dies in integrated circuit packages
|
US2007267734A1
|
|
No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
|