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ZHAO SAM ZIQUN

Overview
  • Total Patents
    21
About

ZHAO SAM ZIQUN has a total of 21 patent applications. Its first patent ever was published in 2006. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, audio-visual technology and telecommunications are SILICONWARE PRECISION INDUSTRIES CO LTD, TAIWAN SEMICONDUCTOR MANFACTUR and OHKUCHI MAT CO LTD.

Patent filings in countries

World map showing ZHAO SAM ZIQUNs patent filings in countries
# Country Total Patents
#1 United States 21

Patent filings per year

Chart showing ZHAO SAM ZIQUNs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhao Sam Ziqun 21
#2 Khan Rezaur Rahman 13
#3 Vorenkamp Pieter 5
#4 Chen Xiangdong 5
#5 Karikalan Sampath K V 5
#6 Hu Kevin Kunzhong 5
#7 Boers Michael 4
#8 Behzad Arya 4
#9 Rofougaran Ahmadreza 4
#10 Castaneda Jesus 4

Latest patents

Publication Filing date Title
US2012225522A1 Package 3D interconnection and method of making same
US2013221500A1 System-in-package with integrated socket
US2013221506A1 Semiconductor packages with integrated heat spreaders
US2013221525A1 Semiconductor package with integrated selectively conductive film interposer
US2013214408A1 Interposer Having Conductive Posts
US2013193996A1 Semiconductor package with improved testability
US2013168841A1 Programmable interposer with conductive particles
US2013082363A1 Device having wirelessly enabled functional blocks
US2013078915A1 Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding
US2012314367A1 Methods and systems for on-chip osmotic airflow cooling
US2012212244A1 Test board for use with devices having wirelessly enabled functional blocks and method of using same
US2012086114A1 Millimeter devices on an integrated circuit
US2011316139A1 Package for a wireless enabled integrated circuit
US2012126396A1 Die down device with thermal connector
US2011176279A1 Electromagnetic interference shield with integrated heat sink
US2009051010A1 IC package sacrificial structures for crack propagation confinement
US2007290376A1 Integrated circuit (IC) package stacking and IC packages formed by same
US2007290322A1 Thermal improvement for hotspots on dies in integrated circuit packages
US2007267734A1 No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement