| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 9 | |
| #2 | United States | 7 | |
| #3 | China | 1 | |
| #4 | EPO (European Patent Office) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Gogoi Bishnu Prasanna | 9 |
| #2 | Davies Robert Bruce | 7 |
| #3 | Moline Daniel D | 1 |
| #4 | Le Phuong T | 1 |
| #5 | Elliott Alex | 1 |
| #6 | Rice Dave | 1 |
| #7 | Tischler Michael Albert | 1 |
| #8 | Crowder Jeffrey Dale | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2013087894A1 | Flange package for a semiconductor device | |
| CN101855721A | Semiconductor structure and method of manufacture |