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TOSHIBA SEIKI KK

Overview
  • Total Patents
    630
About

TOSHIBA SEIKI KK has a total of 630 patent applications. Its first patent ever was published in 1970. It filed its patents most often in Japan, Germany and United Kingdom. Its main competitors in its focus markets semiconductors, machine tools and packaging and shipping are WUXI CHINA RESOURCE MICRO-ASSEMBLY TECH LTD, KOREA SEMICINDUCTOR SYSTEM CO and BRUNNBAUER MARKUS.

Patent filings in countries

World map showing TOSHIBA SEIKI KKs patent filings in countries
# Country Total Patents
#1 Japan 623
#2 Germany 2
#3 United Kingdom 2
#4 France 1
#5 Taiwan 1
#6 United States 1

Patent filings per year

Chart showing TOSHIBA SEIKI KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Suzuki Hisaya 108
#2 Mizuno Kenichi 61
#3 Ichikawa Hiroshi 36
#4 Arie Makoto 29
#5 Konishi Nobuomi 27
#6 Abe Shinri 26
#7 Abe Mitsuhito 21
#8 Yamaguchi Masato 20
#9 Takeda Yasushi 19
#10 Saito Akihide 18

Latest patents

Publication Filing date Title
JPH08255809A Lead frame heating method and device thereof
JPH08264583A Wire bonding device
JPH08231046A Lead frame feeder
JPH08222601A Pellet bonding apparatus
JPH08204261A Laser equipment
JPH07302344A Pattern recognizing device
JPH08191518A Film removal apparatus of covered wire
JPH08191087A Method and equipment for wire bonding
JPH08165045A Plural row conveyer device
JPH08165044A Direction changing conveyer device
JPH08165054A Control system for conveyer
JPH08153736A Pellet bonding device
JPH07179224A Magazine transferring method
JPH07201897A Pellet bonding apparatus
JPH0864629A Wire bonding method
JPH0864630A Wire bonding method
JPH0864620A Thrust-up device of semiconductor pellet
JPH0820433A Booklet feeder
JPH0817851A Pellet position detecting method of pellet bonding device
JPH0812085A Booklet supplying device