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CHEN MENG-TSE

Overview
  • Total Patents
    14
About

CHEN MENG-TSE has a total of 14 patent applications. Its first patent ever was published in 2011. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, machine tools and machines are LIN JING-CHENG, CARSEM M SDN BHD and KOBAYAKAWA MASAHIKO.

Patent filings in countries

World map showing CHEN MENG-TSEs patent filings in countries
# Country Total Patents
#1 United States 14

Patent filings per year

Chart showing CHEN MENG-TSEs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Liu Chung-Shi 14
#2 Cheng Ming-Da 14
#3 Chen Meng-Tse 14
#4 Lin Chun-Cheng 8
#5 Lin Wei-Hung 7
#6 Lin Chih-Wei 5
#7 Tsai Yu-Peng 5
#8 Huang Kuei-Wei 5
#9 Lin Hsiu-Jen 4
#10 Lu Wen-Hsiung 4

Latest patents

Publication Filing date Title
US2014061932A1 Methods and apparatus for package on package structures
US2014048934A1 Method to control underfill fillet width
US2014045300A1 Warpage control in a package-on-package structure
US2014001652A1 Package-on-package structure having polymer-based material for warpage control
US2013260535A1 Method and apparatus for reducing package warpage
US2013285238A1 Stud bump structure for semiconductor package assemblies
US2013234317A1 Packaging Methods and Packaged Semiconductor Devices
US2013113116A1 Contact and method of formation
US2013115735A1 Apparatus and methods for molded underfills in flip chip packaging
US2013102112A1 Process for forming packages
US2013099385A1 Packages and methods for forming the same
US2013095608A1 Methods for forming 3DIC package
US2013075921A1 Semiconductor packages having polymer-containing substrates and methods of forming same
US2012299181A1 Package-on-package process for applying molding compound