TSAI CHUNG CHE has a total of 12 patent applications. Its first patent ever was published in 2018. It filed its patents most often in China, EPO (European Patent Office) and Japan. Its main competitors in its focus markets semiconductors and machines are BRUNNBAUER MARKUS, ASE ASSEMBLY AND TEST SHANGHAI LTD and NEC SEMICONDUCTORS KYUSHU LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | China | 2 | |
#2 | EPO (European Patent Office) | 2 | |
#3 | Japan | 2 | |
#4 | Republic of Korea | 2 | |
#5 | Taiwan | 2 | |
#6 | United States | 2 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Shaping of plastics | |
#3 | Certain plastics |
# | Name | Total Patents |
---|---|---|
#1 | Tsai Chung-Che | 10 |
#2 | Tsai Chung Che | 2 |
Publication | Filing date | Title |
---|---|---|
JP2020088373A | Semiconductor package and fabrication method thereof | |
US2020168557A1 | Semiconductor package and fabrication method thereof | |
TW202034471A | Semiconductor package and fabrication method thereof | |
TW202021079A | Semiconductor package with in-package compartmental shielding and fabrication method thereof |