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KOREA SEMICINDUCTOR SYSTEM CO

Overview
  • Total Patents
    50
About

KOREA SEMICINDUCTOR SYSTEM CO has a total of 50 patent applications. Its first patent ever was published in 1997. It filed its patents most often in Republic of Korea and China. Its main competitors in its focus markets semiconductors, machine tools and machines are SEMILEDS CORP, WUXI CHINA RESOURCE MICRO-ASSEMBLY TECH LTD and UHLMANN RUEDIGER.

Patent filings in countries

World map showing KOREA SEMICINDUCTOR SYSTEM COs patent filings in countries
# Country Total Patents
#1 Republic of Korea 49
#2 China 1

Patent filings per year

Chart showing KOREA SEMICINDUCTOR SYSTEM COs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Park Myung Soon 30
#2 Lee Seung Woo 5
#3 Kwon Young Hee 3
#4 Kim Yong Hwa 2
#5 Kang Il Yun 2
#6 Park Myeong Sun 2
#7 Soon Park Myung 1
#8 Kim Dong Hwan 1
#9 Park Myung-Soon 1
#10 Kim Yong Haw 1

Latest patents

Publication Filing date Title
KR100923430B1 Method of processing board for manufacturing semiconductor element
KR100923432B1 Method of forming groove to bump through molding layer and apparatus used therein
KR20100081705A Method of dicing solar cell wafer using laser beam and apparatus using therefor
KR20090048312A Control method of picker apparatus of semiconductor element for tranportation
KR20090078278A Injectin molding solder apparatus for preventing cavity generation during injection of molten solder into substrate and method thereof
KR100872793B1 Picker apparatus of semiconductor element for tranportation and control method thereof
KR100870840B1 Manufacturing method of element having bump groove pattern
KR20080038007A Structure of fixing and separating tool used in manufacturing semiconductor element
KR100779451B1 Flux cartridge for solder ball attach machine and guide block of pressing member used therein
KR100779454B1 Flux pin used in flux tool for solder ball attach machine and flux tool having same
KR100788191B1 Bump forming process of semiconductor element
KR100735537B1 An auto error detection and correction method for bump making process of semiconductor element by jetting way
KR100831890B1 Flux cartridge for solder ball attach machine
KR100735517B1 Solder ball attach machine having improved pick-up performance and control method thereof
KR100742975B1 Solder ball attach machine and control method thereof
KR100795772B1 Method of preventing melted metallic compound from having oxidized film thereon during bump formation process and apparatus therefor
KR100835977B1 A chuck table for wafer sawing device
KR100730487B1 A strip position correction method used single camera of equipment for making of semiconductor element and device therefore
KR100684500B1 A solder ball attach plate using mems tech and making method therefore
KR100794494B1 A eject pin for solder ball attach tool using mems tech and making method therefore