Learn more

SHANGHAI KAIHONG ELECTRONIC CO LTD

Overview
  • Total Patents
    28
  • GoodIP Patent Rank
    103,566
  • Filing trend
    ⇧ 200.0%
About

SHANGHAI KAIHONG ELECTRONIC CO LTD has a total of 28 patent applications. It increased the IP activity by 200.0%. Its first patent ever was published in 2008. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, audio-visual technology and packaging and shipping are SHARP TAKAYA DENSHI KOGYO KK, TANAKA ELECTRONICS IND CO LTD and SHINKAWA SEISAKUSHO KK.

Patent filings in countries

World map showing SHANGHAI KAIHONG ELECTRONIC CO LTDs patent filings in countries
# Country Total Patents
#1 China 28

Patent filings per year

Chart showing SHANGHAI KAIHONG ELECTRONIC CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yang Xiaorui 13
#2 Wu Wei 5
#3 Dong Meidan 5
#4 Xu Wenyao 3
#5 Zhang Jiangyuan 3
#6 Danna Liu 3
#7 Wu Pingli 2
#8 Zhining Li 2
#9 Wu Tengfei 2
#10 Jiangyuan Zhang 2

Latest patents

Publication Filing date Title
CN111584417A Method for grinding wafer
CN110626834A Full-automatic reel loading and unloading device
CN112242373A Lead frame and packaging mold
CN109243988A Packaging body and its packaging method
CN109119396A Lead frame and the packaging body for using the lead frame
CN108649020A The packaging method of stacked chips and the packaging body manufactured using this method
CN107039329A For the method for packing and packaging body of the small-sized package body of thin substrate
CN106684064A High-density packaging body, lead wire framework, packaging unit and packaging method
CN106409696A Packaging method and packaging body
CN105938826A Lead frame for improving layering of frame surface and plastic package body and package body
CN105810648A Package body and package method
CN105720035A Lead frame and packaging body employing same
CN105513976A Semiconductor packaging method, packaging body and packaging unit
CN105655315A Lead wire framework used for packaging structure without pin and manufacturing method thereof, and packaging structure
CN105244292A Plastic packaging mould with irregular-shaped tooth sockets and method for removing excessive glue
CN104821306A Ultra small-scale encapsulation method and encapsulation body
CN103730381A Chip packaging method
CN103730451A Multi-chip packaging body and packaging method
CN103730441A Lead frame and method for packaging semiconductor device with lead frame
CN102842567A Lead frame fixing device and packaging method