SUMMERFELT SCOTT R has a total of 15 patent applications. Its first patent ever was published in 2006. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, computer technology and environmental technology are SHANGHAI HUALI MICROELECTRONIC, KITAMURA MASAHIRO and BECKER SCOTT T.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 15 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Computer technology | |
#3 | Environmental technology |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Climate change mitigation in goods production | |
#3 | Static stores | |
#4 | Electric digital data processing |
# | Name | Total Patents |
---|---|---|
#1 | Summerfelt Scott R | 15 |
#2 | Mcadams Hugh P | 4 |
#3 | Meisner Stephen A | 2 |
#4 | Bartling Steven Craig | 2 |
#5 | Fleck Robert G | 2 |
#6 | Udayakumar Kezhakkedath R | 2 |
#7 | Rodriguez John Anthony | 2 |
#8 | Aggarwal Rajni J | 2 |
#9 | Campbell John P | 2 |
#10 | Robbins John B | 2 |
Publication | Filing date | Title |
---|---|---|
US2010295149A1 | Integrated circuit structure with capacitor and resistor and method for forming | |
US2010296329A1 | Differential plate line screen test for ferroelectric latch circuits | |
US2011084323A1 | Transistor performance modification with stressor structures | |
US2010090340A1 | Drawn dummy FeCAP, via and metal structures | |
US2010041232A1 | Adjustable dummy fill | |
US2010038749A1 | Contact and VIA interconnects using metal around dielectric pillars | |
US2009321964A1 | Stress buffer layer for ferroelectric random access memory | |
US2009243122A1 | Alignment mark for opaque layer | |
US2008121953A1 | Enhanced local interconnects employing ferroelectric electrodes |