|
CN112133626A
|
|
Manufacturing method of metal hard mask and wafer
|
|
CN110729181A
|
|
Manufacturing method of high-electron-mobility transistor T-shaped gate, T-shaped gate and transistor
|
|
CN110718456A
|
|
High-reliability T-shaped gate manufacturing method, T-shaped gate and high-electron-mobility transistor
|
|
CN110010454A
|
|
A kind of manufacturing process of 0.15 micron of T shape grid
|
|
CN109979991A
|
|
A kind of photoetching process, T shape grid and transistor based on I-line and EBL production T shape grid
|
|
CN109817559A
|
|
A kind of double-sided alignment process for wafer processing
|
|
CN109243971A
|
|
A kind of semiconductor devices deielectric-coating low angle engraving method
|
|
CN109103088A
|
|
A kind of evaporation coating method of metal ohmic contact germanium and its application
|
|
CN109037035A
|
|
A kind of method and system for improving SiC base GaN wafer and carrying on the back golden adhesiveness
|
|
CN108766930A
|
|
A kind of novel convenient and cheap wafer jig production method, wafer jig and application method
|
|
CN108417643A
|
|
A kind of temperature-compensating film resistor and preparation method thereof
|
|
CN108416167A
|
|
A kind of GaN HEMT devices multiple physical field coupling large-signal model method for building up
|
|
CN108417480A
|
|
A kind of reduction grinding wafer front damage method
|
|
CN108376677A
|
|
A kind of offside cascaded semiconductor chip apparatus and Cascading Methods
|
|
CN108364912A
|
|
A kind of plane cascade semiconductor chiop and Cascading Methods
|
|
CN108376644A
|
|
A kind of semiconductor die circular hole production method
|
|
CN108281348A
|
|
The root cavity wall angle adjusting method and T-type grid preparation method of T-type litho pattern
|
|
CN108565213A
|
|
A kind of manufacturing method of high electron mobility transistor T shape grid
|
|
CN108281352A
|
|
A kind of device isolation method applied to gallium nitride transistor
|
|
CN108054162A
|
|
A kind of MIM capacitor manufacturing process
|
