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SHANGHAI HUALI MICROELECTRONIC

Overview
  • Total Patents
    41
About

SHANGHAI HUALI MICROELECTRONIC has a total of 41 patent applications. Its first patent ever was published in 2011. It filed its patents most often in China and United States. Its main competitors in its focus markets semiconductors and computer technology are KITAMURA MASAHIRO, SHROFF MEHUL D and ZGLUE INC.

Patent filings in countries

World map showing SHANGHAI HUALI MICROELECTRONICs patent filings in countries
# Country Total Patents
#1 China 40
#2 United States 1

Patent filings per year

Chart showing SHANGHAI HUALI MICROELECTRONICs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Hu Youcun 7
#2 Chen Yuwen 6
#3 Yuwen Chen 6
#4 Li Lei 5
#5 Ji Feng 5
#6 Zhang Liang 5
#7 Zhou Jun 4
#8 Yongfeng Cao 4
#9 Zhengying Wei 3
#10 Zhibiao Mao 3

Latest patents

Publication Filing date Title
CN102436137A Method for reducing vaporific defect of maskplate
CN102437127A One-transistor dynamic random access memory (DRAM) unit based on silicon-germanium silicon heterojunction, and method for preparing one-transistor DRAM unit
CN102437189A Silicon nanowire device and manufacturing method thereof
CN102437158A Complementary metal oxide semiconductor (CMOS) device and manufacturing method thereof
CN102437024A Method for manufacturing multilayer metal-silicon oxide-metal (MOM) capacitor
CN102437108A Manufacturing method of copper interconnection structure capable of reducing block resistance
CN102437021A Cleaning method in chemical mechanical polishing
CN102437039A Method for forming side wall by uniformly depositing silicon nitride
CN102437190A Silicon nanowire device and manufacturing method thereof
CN102437023A Method for manufacturing multilayer metal-oxide-metal capacitor
CN102437069A Method and device for monitoring pretreatment in low-dielectric-constant barrier layer process
CN102437126A Single-transistor DRAM (dynamic random access memory) unit based on source heterojunction and preparation method thereof
CN102437064A Manufacturing method of silicon Nano-wire (SiNW)
CN102437041A Method for forming high-order electric constant K and T-shaped metal grid
CN102437106A Method for improving repeatability of multi-time photoetching on contact hole/through hole
CN102437107A Method for manufacturing integrated circuit with super-thick top-layer metal and integrated circuit
CN102437105A Method for producing integrated circuit having partial redundant through holes and integrated circuit
CN102437103A Method for manufacturing integrated circuit with partially-redundant through holes and integrated circuit
CN102437104A Manufacturing method of integrated circuit having a portion of redundant through holes and integrated circuit
CN102437072A Method and system for scanning and scheduling wafer defects