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STATS CHIPPAC INC

Overview
  • Total Patents
    22
About

STATS CHIPPAC INC has a total of 22 patent applications. Its first patent ever was published in 2005. It filed its patents most often in United States, Japan and Taiwan. Its main competitors in its focus markets semiconductors, audio-visual technology and surface technology and coating are SIRINORAKUL SARAVUTH, BOBDE MADHUR and CHO NAMJU.

Patent filings in countries

World map showing STATS CHIPPAC INCs patent filings in countries
# Country Total Patents
#1 United States 11
#2 Japan 6
#3 Taiwan 3
#4 Republic of Korea 2

Patent filings per year

Chart showing STATS CHIPPAC INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Pendse Rajendra D 10
#2 Chow Seng Guan 4
#3 Karnezos Marcos 2
#4 Rajendra D Pendse 2
#5 Kuan Francis Heap Hoe 2
#6 Ramakrishna Kambhampati 1
#7 Kim Hyun Uk 1
#8 Kim Yong Suk 1
#9 Espiritu Emmanuel A 1
#10 Kim Oh Sug 1

Latest patents

Publication Filing date Title
US2008136022A1 Direct via wire bonding and method of assembling the same
US2008164618A1 Semiconductor package with flow controller
US2008164587A1 Molding compound flow controller
US2008157301A1 Leadframe package for MEMS microphone assembly
US2008136003A1 Multi-layer semiconductor package
US2008128081A1 Pick-up heads and systems for die bonding and related applications
US2008122117A1 Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps
US2008067695A1 Semiconductor assembly with component attached on die back side
US2006175696A1 Nested integrated circuit package on package system