STATS CHIPPAC INC has a total of 22 patent applications. Its first patent ever was published in 2005. It filed its patents most often in United States, Japan and Taiwan. Its main competitors in its focus markets semiconductors, audio-visual technology and surface technology and coating are SIRINORAKUL SARAVUTH, BOBDE MADHUR and CHO NAMJU.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 11 | |
#2 | Japan | 6 | |
#3 | Taiwan | 3 | |
#4 | Republic of Korea | 2 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology | |
#3 | Surface technology and coating | |
#4 | Micro-structure and nano-technology | |
#5 | Machines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Loudspeakers and microphones | |
#3 | Unspecified technologies | |
#4 | Microstructural devices | |
#5 | Layered products |
# | Name | Total Patents |
---|---|---|
#1 | Pendse Rajendra D | 10 |
#2 | Chow Seng Guan | 4 |
#3 | Karnezos Marcos | 2 |
#4 | Rajendra D Pendse | 2 |
#5 | Kuan Francis Heap Hoe | 2 |
#6 | Ramakrishna Kambhampati | 1 |
#7 | Kim Hyun Uk | 1 |
#8 | Kim Yong Suk | 1 |
#9 | Espiritu Emmanuel A | 1 |
#10 | Kim Oh Sug | 1 |
Publication | Filing date | Title |
---|---|---|
US2008136022A1 | Direct via wire bonding and method of assembling the same | |
US2008164618A1 | Semiconductor package with flow controller | |
US2008164587A1 | Molding compound flow controller | |
US2008157301A1 | Leadframe package for MEMS microphone assembly | |
US2008136003A1 | Multi-layer semiconductor package | |
US2008128081A1 | Pick-up heads and systems for die bonding and related applications | |
US2008122117A1 | Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps | |
US2008067695A1 | Semiconductor assembly with component attached on die back side | |
US2006175696A1 | Nested integrated circuit package on package system |