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CAMACHO ZIGMUND RAMIREZ

Overview
  • Total Patents
    71
  • GoodIP Patent Rank
    205,349
About

CAMACHO ZIGMUND RAMIREZ has a total of 71 patent applications. Its first patent ever was published in 2006. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors and audio-visual technology are SHENZHEN LIZHEN SEMICONDUCTOR CO LTD, QIAN YIN and STAHNSDORF GLEICHRICHTER.

Patent filings in countries

World map showing CAMACHO ZIGMUND RAMIREZs patent filings in countries
# Country Total Patents
#1 United States 71

Patent filings per year

Chart showing CAMACHO ZIGMUND RAMIREZs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors
#2 Audio-visual technology

Focus technologies

# Technology
#1 Semiconductor devices
#2 Loudspeakers and microphones

Top inventors

# Name Total Patents
#1 Camacho Zigmund Ramirez 71
#2 Bathan Henry Descalzo 48
#3 Tay Lionel Chien Hui 26
#4 Espiritu Emmanuel 22
#5 Pisigan Jairus Legaspi 13
#6 Punzalan Jeffrey D 9
#7 Trasporto Arnel 7
#8 Caparas Jose Alvin 6
#9 Trasporto Arnel Senosa 5
#10 Advincula Abelardo Jr Hadap 5

Latest patents

Publication Filing date Title
US9355983B1 Integrated circuit packaging system with interposer structure and method of manufacture thereof
US9406531B1 Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof
US9331003B1 Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof
US2015179602A1 Integrated circuit packaging system with conductive ink and method of manufacture thereof
US2013154115A1 Integrated circuit packaging system with leads and method of manufacturing thereof
US2013075883A1 Integrated circuit packaging system with dual connection and method of manufacture thereof
US2012018866A1 Integrated circuit packaging system with island terminals and method of manufacture thereof
US2012018865A1 Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof
US2012326286A1 Integrated circuit packaging system with wafer level reconfiguration and method of manufacture thereof
US2012299196A1 Integrated circuit packaging system with interlock and method of manufacture thereof
US2012241968A1 Integrated circuit packaging system with interconnects and method of manufacture thereof
US2012241947A1 Integrated circuit packaging system with locking interconnects and method of manufacture thereof
US2012241962A1 Integrated circuit packaging system with lead frame etching and method of manufacture thereof
US2012241948A1 Integrated circuit packaging system with pads and method of manufacture thereof
US2012241926A1 Integrated circuit packaging system with leveling standoff and method of manufacture thereof
US2012241966A1 Integrated circuit packaging system with plated leads and method of manufacture thereof
US2011169151A1 Integrated circuit packaging system with lead interlocking mechanisms and method of manufacture thereof
US2012139104A1 Integrated circuit packaging system with pad connection and method of manufacture thereof
US2012133033A1 Integrated circuit packaging system with multi-row leads and method of manufacture thereof
US2012133036A1 Integrated circuit packaging system with connection supports and method of manufacture thereof