|
US2005194698A1
|
|
Integrated circuit package with keep-out zone overlapping undercut zone
|
|
US6627990B1
|
|
Thermally enhanced stacked die package
|
|
US2003160309A1
|
|
Ground plane for exposed package
|
|
US2003057545A1
|
|
PBGA substrate for anchoring heat sink
|
|
US2002163064A1
|
|
Enhanced BGA grounded heatsink
|
|
US2002093080A1
|
|
Process and support carrier for flexible substrates
|
|
US6544812B1
|
|
Single unit automated assembly of flex enhanced ball grid array packages
|
|
US6597188B1
|
|
Ground land for singulated ball grid array
|
|
US6468361B1
|
|
PBGA singulated substrate for model melamine cleaning
|
|
US6543127B1
|
|
Coplanarity inspection at the singulation process
|
