| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 4 | |
| #2 | EPO (European Patent Office) | 3 | |
| #3 | Singapore | 3 | |
| #4 | Japan | 2 | |
| #5 | China | 1 | |
| #6 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Macromolecular chemistry and polymers |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Special macromolecular compounds | |
| #4 | Shaping of plastics | |
| #5 | Fillers |
| # | Name | Total Patents |
|---|---|---|
| #1 | Zimmerman Michael | 10 |
| #2 | Zimmerman Michael A | 4 |
| #3 | Harris Jonathan | 2 |
| #4 | Shverdin Jacob | 2 |
| #5 | Smith Keith | 2 |
| Publication | Filing date | Title |
|---|---|---|
| WO2011022010A1 | Ultra high-temperature plastic package and method of manufacture | |
| US2009295036A1 | Ultra high-temperature plastic package and method of manufacture | |
| SG157957A1 | Package for integrated circuit die |