| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 6 | |
| #2 | WIPO (World Intellectual Property Organization) | 2 | |
| #3 | Australia | 1 | |
| #4 | Canada | 1 | |
| #5 | EPO (European Patent Office) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Machines | |
| #4 | Measurement |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Casings and printed circuits | |
| #3 | Unspecified technologies | |
| #4 | Measuring electric variables |
| # | Name | Total Patents |
|---|---|---|
| #1 | Tuckerman David B | 9 |
| #2 | Brathwaite Nicholas E | 6 |
| #3 | Mcwilliams Bruce M | 3 |
| #4 | Flatow Kirk | 3 |
| #5 | Marella Paul | 3 |
| #6 | Patel Pradip D | 2 |
| #7 | Benson Donald | 2 |
| #8 | Bobra Yogendra | 2 |
| #9 | Schoenholtz Joseph Jr | 2 |
| #10 | Tuckerman David | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US5541524A | Burn-in technologies for unpackaged integrated circuits | |
| WO9323982A1 | Stacked devices for multichip modules | |
| US5274270A | Multichip module having SiO2 insulating layer | |
| WO9304375A1 | Burn-in technologies for unpackaged integrated circuits | |
| CA2057744A1 | Multichip module | |
| US5214844A | Method of assembling integrated circuits to a silicon board | |
| US5134539A | Multichip module having integral decoupling capacitor |